Vehicle Electronics PCBA board
Siffar samfuran
● - Gwajin dogaro
● -Tsarin ganowa
● -Gudanar da thermal
● -Tagulla mai nauyi ≥ 105um
● -HDI
● -Semi - sassauci
● -Rigid - sassauƙa
● -Maɗaukakiyar mitoci mai girma
PCB tsarin halaye
1. Dielectric Layer (Dielectric): Ana amfani dashi don kula da rufin tsakanin layi da yadudduka, wanda aka fi sani da substrate.
2. Silkscreen (Legend/Marking/Silkscreen): Wannan abu ne mara mahimmanci.Babban aikinsa shi ne sanya alamar suna da akwatin matsayi na kowane bangare a kan allon kewayawa, wanda ya dace don tabbatarwa da ganewa bayan haɗuwa.
3.Surface jiyya (SurtaceFinish): Tun da jan karfe surface ne sauƙi oxidized a cikin general yanayi, shi ba za a iya tinned ( matalauta solderability), don haka da jan karfe surface da za a tinned za a kare.Hanyoyin kariyar sun haɗa da HASL, ENIG, Azurfa Immersion, Immersion Tin, da kuma kayan kayyade solder (OSP).Kowace hanya tana da nata abũbuwan amfãni da rashin amfani, tare da ake magana a kai a matsayin surface jiyya.
Ƙarfin Fasaha na PCB
| Yadudduka | Samar da taro: 2 ~ 58 yadudduka / Pilot gudu: 64 yadudduka |
| Max.Kauri | Samar da taro: 394mil (10mm) / Gudun Pilot: 17.5mm |
| Kayan abu | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Gubar free taro kayan) , Halogen-Free, Ceramic cika, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial matasan, da dai sauransu |
| Min.Nisa/Tazara | Layer na ciki: 3mil/3mil (HOZ), Layer na waje: 4mil/4mil (1OZ) |
| Max.Kaurin Copper | UL takaddun shaida: 6.0 OZ / Gudun Pilot: 12OZ |
| Min.Girman Ramin | Sojin injiniya: 8mil (0.2mm) Laser rawar soja: 3mil (0.075mm) |
| Max.Girman panel | 1150mm × 560mm |
| Halayen Rabo | 18:1 |
| Ƙarshen Sama | HASL, Zinare na Immersion, Tin Immersion, OSP, ENIG + OSP, Azurfa Immersion, ENEPIG, Yatsa Zinare |
| Tsari na Musamman | Ramin da aka binne, Ramin Makafi, Juriya da aka haɗa, Ƙarfin Ƙarfafawa, Matasa, Ƙaƙwalwar ɓangarori, Ƙarƙashin ƙima mai yawa, hakowa baya, da sarrafa juriya |
