Vehicle Electronics PCBA board
Siffar samfuran
● - Gwajin dogaro
● -Tsarin ganowa
● - Gudanar da thermal
● -Tagulla mai nauyi ≥ 105um
● -HDI
● -Semi - sassauci
● -Rigid - sassauƙa
● -Maɗaukakiyar mitoci mai girma
PCB tsarin halaye
1. Dielectric Layer (Dielectric): Ana amfani dashi don kula da rufin tsakanin layi da yadudduka, wanda aka fi sani da substrate.
2. Silkscreen (Legend/Marking/Silkscreen): Wannan abu ne mara mahimmanci. Babban aikinsa shi ne sanya alamar suna da akwatin matsayi na kowane bangare a kan allon kewayawa, wanda ya dace don tabbatarwa da ganewa bayan haɗuwa.
3.Surface jiyya (SurtaceFinish): Tun da jan karfe surface ne sauƙi oxidized a cikin general yanayi, shi ba za a iya tinned ( matalauta solderability), don haka da jan karfe surface da za a tinned za a kare. Hanyoyin kariyar sun haɗa da HASL, ENIG, Azurfa Immersion, Immersion Tin, da kuma kayan kayyade solder (OSP). Kowace hanya tana da nata abũbuwan amfãni da rashin amfani, tare da ake magana a kai a matsayin surface jiyya.
Ƙarfin Fasaha na PCB
| Yadudduka | Samar da taro: 2 ~ 58 yadudduka / Pilot gudu: 64 yadudduka |
| Max. Kauri | Samar da taro: 394mil (10mm) / Gudun Pilot: 17.5mm |
| Kayan abu | FR-4 (Standard FR4, Mid-Tg FR4, Hi-Tg FR4, Gubar free taro kayan) , Halogen-Free, Ceramic cika, Teflon, Polyimide, BT, PPO, PPE, Hybrid, Partial matasan, da dai sauransu |
| Min. Nisa/Tazara | Layer na ciki: 3mil/3mil (HOZ), Layer na waje: 4mil/4mil(1OZ) |
| Max. Kaurin Copper | UL takaddun shaida: 6.0 OZ / Gudun Pilot: 12OZ |
| Min. Girman Ramin | Sojin injiniya: 8mil (0.2mm) Laser rawar soja: 3mil (0.075mm) |
| Max. Girman panel | 1150mm × 560mm |
| Rabo Halaye | 18:1 |
| Ƙarshen Sama | HASL, Zinare na Immersion, Tin Immersion, OSP, ENIG + OSP, Azurfa Immersion, ENEPIG, Yatsa Zinare |
| Tsari na Musamman | Ramin da aka binne, Ramin Makafi, Juriya da aka haɗa, Ƙarfin Ƙarfafawa, Matasa, Ƙaƙwalwar ɓangarori, Ƙarƙashin ƙima mai yawa, hakowa baya, da sarrafa juriya |
