Tasha guda ɗaya mai keɓantawar hukumar PCBA uwar garken lantarki

1. Circuit da juna (Tsarin): Ana amfani da kewayawa azaman kayan aiki don gudanar da tsakanin abubuwan da aka gyara.A cikin zane, za a tsara babban filin tagulla a matsayin ƙasa da kuma samar da wutar lantarki.Ana yin layi da zane-zane a lokaci guda.

2. Hole (Throughole/via): Ramin ta hanyar rami na iya sanya layin sama da matakan biyu su gudanar da juna, mafi girma ta rami ana amfani da shi azaman abubuwan toshewa, kuma ramin mara amfani (nPTH) galibi ana amfani dashi. a matsayin saman hawa da matsayi, ana amfani da shi don gyara sukurori yayin taro.

3. Solderresistant tawada (Solderresistant/SolderMask): Ba duk saman jan karfe ne ya kamata ya ci sassan tin ba, don haka wurin da ba a ci ba za a buga shi da wani Layer na abu (yawanci resin epoxy) wanda ke ware saman jan karfe daga cin tin zuwa ga abin da ba a ci ba. kauce wa rashin saida.Akwai gajeriyar kewayawa tsakanin layin tinned.Dangane da matakai daban-daban, an raba shi zuwa koren mai, jan man fetur da mai shudi.

4. Dielectric Layer (Dielectric): Ana amfani dashi don kula da rufin tsakanin layi da yadudduka, wanda aka fi sani da substrate.